Apple is working on its latest MacBook Pro models, which will be powered by the next-generation M5 chip. The tech giant has ...

The M5 chips are expected to bring improvements through advanced 3-nanometer technology, enhancing speed and efficiency.

One of the core innovations is that Broadcom uses face-to-face 3D chip-stacking technology based on hybrid bonding, which connects the pillars of copper wiring on the front of each silicon die ...

This 3D chip-stacking approach vertically stacks the chips, which enhances thermal management and reduces electrical leakage compared to traditional 2D designs. Apple is said to have expanded its ...

The importance effect of stacking in 3D structure is increased peak temperature [14] [15] [16]. The temperature in the chip can reach more than 100ºC. Temperature variation between dies can be around ...

The development of a monolithic 3D DRAM chip could provide an immediate boost ... "When commercially viable 3D DRAM is available and die stacking challenges such as thermal management have been ...

Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (SatCom) technology, has been selected as a laureate startup to compete in the Innovation Challenge at ...

Despite integration challenges, third-party chiplets offer cost savings and flexibility. Intel and AMD are optimizing performance with advanced interconnects, PHYs, and 3D stacking. Semiconductor ...