The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

YMTC is known for 3D NAND, a flash memory in which transistor die are stacked vertically to increase storage density.

With self-developed chips Apple will reduce its dependence on third-party suppliers, thereby reducing component costs and optimizing the supply chain. This not only helps to improve the ...

They have abbreviated these 3D GAA transistors as NXFETs, where N=nano, and X=sheet, fork or plate represent the topology of the channel stacking. Their study establishes how such transistors can be ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

DatacenterDynamics is the world's largest data center publication. We publish news, magazine features, and podcasts about the ...

Finally 3D integration introduces small form factor which is very suitable for mobile devices. The importance effect of stacking in 3D structure is increased peak temperature [14] [15] [16]. The ...

AMD just announced over a dozen new laptop CPUs, which will appear in over 150 new laptops being announced at CES 2025 and later this year, including a new 3D V-Cache chip for gaming laptops and some ...

The company's management has exhibited excellent foresight in identifying future trends in chip manufacturing. For example, it recognized the shift from 2D NAND to 3D NAND very early and developed ...