Researchers propose 3D semiconductor architectures using 2D semiconductor materials for better performance and scalability ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Milpitas, Calif., April 26, 2012 – GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab ...

New concept of electronic design has been introduced a few years back which is 3D integration. This technology enable building circuits in 3 dimensional (3D) structures by stacking the wafers or dies ...

In addition, InFO_SoW wafers are processed using a single node, and this node does not support 3D stacking, which will be supported by CoW-SoW products.

In a significant advancement for semiconductor technology, ECE's Prof. Kaustav Banerjee , co-authors Arnab Pal & Wei Cao and researchers have unveiled novel three-dimensional (3D) transistors ...

Another future trend predicted by IDTechEx is advanced 3D stacking, whereby interconnectivity and thermal management can be ...

Everything you need to know about AMD's flagship Ryzen 9 9950X3D processor as reviews go live and availability begins March. 12 ...

The small 3D-printed “tape reels” can double as dispensers, and stack nicely onto each other thanks to the sockets for magnets. The units come in a few different sizes, but are designed to ...