TSM showcases A14 chip at tech symposium, plans 1.4-nm chip production in 2028. A14 offers faster computing and greater power ...

3D integration approaches entail stacking ... bonding individual chips together. Researchers at Pennsylvania State University recently developed highly compact near-sensor computing chips via ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence ...

The AI-driven digital and analog flows, multi-die Innovations, and broad IP portfolio deliver unmatched performance, power, and area advantages ...

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly working with Nvidia to develop next-generation GPUs utilizing advanced chiplet technology. This collaboration is expected to play an ...

Forward-looking: Researchers at the University of Massachusetts Amherst have developed a laser-based technique to align 3D semiconductor chips ... which involve stacking multiple 2D layers.

based startup develops photonic tech used in datacenter networking chips. The company notes that it has invented the world's first 3D ... for the advanced AI and high performance computing ...