[Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard to spot. At the end of the video, he did find a short (but not on the ...

You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

The top-down view of a high density package is shown in Figure 2 where extremely high pitches are involved. Figure 2: Top-down View of Solder Bump Mapping. The solder bumps can be 0.6mm in diameter ...

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

BEST Inc. is an ISO 9001:2015 and ITAR certified provider of BGA reballing, PCB and component rework services, focusing on quality, reliability, and sustainability. With a commitment to innovation, ...