The wafer is then subjected to various cleaning, annealing, and passivation steps before being diced into individual dies ... and other digital appliances. Simplified process of fabrication of a CMOS ...
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AZoSensors on MSNNew Sensor Geometry Boosts Hall-Effect Performance with MEMS-CMOS IntegrationInnovative inverted pyramid Hall-effect sensors offer improved accuracy and reduced crosstalk, paving the way for ...
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