在智能设备领域，兴森科技近日在互动平台上透露，其新研发的CSP（Chip Scale Package）封装基板正主要应用于存储芯片、射频芯片以及MEMS（Micro-Electro-Mechanical Systems）芯片等多个领域。随着对高性能芯片的需求不断增加，这一创新技术无疑为设备制造商提供了更强的设计和应用自由度。

Texas Instruments says its very, very, very small microcontroller is suitable for devices such as electric toothbrushes, ...

Texas Instruments has officially unveiled the MSPM0C1104, which it claims to be the world's smallest microcontroller. This ...

Bangalore (Karnataka) [India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry partner with IIT Madras in a groundbreaking ...

Compute nodes in AI and HPC data centers increasingly need to reach out beyond the chip or package for additional resources ...

Artificial intelligence (AI) computing giant Nvidia has announced details of how it is adopting silicon photonics and ...

Redmond's boffins on Wednesday announced Majorana 1, a quantum computing chip based on a Topological Core architecture that ...

But how do you go from thinking about change, to making it happen at scale ... package implementations, he drives innovation in Deloitte's delivery methods and go-to-market strategies. Chip's ...