The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some points of failure associated with FPGAs in BGA ...

Altera highlights its latest FPGA innovations at Embedded World 2025, including the Agilex 3 and Agilex 5 E-Series FPGAs.

Altera Corporation unveiled its latest programmable solutions tailored for embedded developers who are pushing the boundaries ...

这是AMD 16nm工艺FPGA或自适应SoC产品线中最小的封装，非常适合摄像头视觉或车载显示应用。 它还采用了芯片尺寸封装(chip-scale package)，可以显著提升I ...

Create a board support package (BSP) for the CPU Generate a library ... you should know how to burn this file into the FPGA. There’s more detail on the blog, but here’s the basic command ...

ALTERA Agilex FPGAs, Quartus Prime Pro software and FPGA AI Suite enable the rapid development of highly customized embedded ...

Altera is launching its latest family of Agilex FPGA chips to help developers expand the boundaries of the intelligent edge.

Software is developed using an Eclipse-based IDE and Board Support Package Editor. One advantage of Softcore Processors is the ability to add a custom instruction, and this is demonstrated building it ...

Altera’s Agilex 3 FPGA, built for power-constrained applications, almost doubles the performance of the Cyclone V.

India]/ Nuremberg [Germany], March 11: Today at Embedded World, Altera Corporation, a leader in FPGA innovations, unveiled ...

[Eric Brombaugh]’s Icehat adds a Lattice iCE5LP4K-SG48 FPGA in a package that fits neatly on top of the Raspberry Pi Zero. It also provides a few LEDs and Digilent compatible PMOD connectors ...

Silicom Ltd. (NASDAQ: SILC), a leading provider of networking and data infrastructure solutions, today announced that an ...