English
全部
图片
视频
地图
资讯
购物
更多
航班
旅游
酒店
搜索
笔记本
Top stories
Sports
U.S.
Local
World
Science
Technology
Entertainment
Business
More
Politics
时间不限
过去 1 小时
过去 24 小时
过去 7 天
过去 30 天
按相关度排序
按时间排序
16 天
夏普推出新型倒装芯片LED
夏普/NEC最新的LED系列FE3系列预计比传统LED技术耗电量低60%。该供应商在ISE 2025上展示了这一点,在那里他建造了三个总尺寸为440英寸的LED塔。这些屏幕的散热明显低于其他不使用倒装芯片SMD技术的这种尺寸的装置。
一些您可能无法访问的结果已被隐去。
显示无法访问的结果
今日热点
To host Golden Globes
200% tariff on EU alcohol?
Plane engine catches fire
Trump Tower protest
Hamas to release hostage
CDC nomination withdrawn
Out as creative director
Ordered to reinstate workers
Says he supports ceasefire
To cut 2,000+ jobs
UN report accuses Israel
States sue to block layoffs
Exits bankruptcy protection
Acne treatments recalled
Swatting call about gunman
Ditch new stadium deal
Texas Tech closes campus
Legendary sportswriter dies
Weekly jobless claims fall
Teixeira pleads guilty
$3B deal to extend rights
Won't block GOP bill
Smishing scam warning
Khalil sues Columbia
IRS demotes chief counsel
Police charge stepmother
Top FDA lawyer resigns
US influencer sparks outrage
FDA, NIH nominees advance
March megastorm
反馈