Semiconductor Engineering6d
Speeding Down Memory Lane With Custom HBM
Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.
Semiconductor Engineering5y
Chiplet Momentum Rising
“Wafer-level test plays a critical and intricate role in the chiplet manufacturing process. Take the case of HBM. It enables early identification of defective DRAM and logic dies so that they can be ...
Hosted on MSN3mon
Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
The platform allows for SiPs with up to 6000mm² of 3D-stacked silicon with 12 HBM modules ... of compute chiplets and stacking one logic chiplet on top of another in a face-to-face (F2F) manner ...
Design-Reuse1y
Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP
highly configurable HBM controller that can be fine-tuned to maximize the efficiency for application-specific AI and high-performance computing workloads. UCIe: Advancing toward a universal chiplet ...
Huawei reportedly acquired two million Ascend 910 AI chips from TSMC last year through shell companies
Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...
Design-Reuse9mon
Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
Alphawave Semi customers are deploying complete HBM subsystem solutions that integrate the company ... the industry in delivering a complete 9.2 Gbps HBM3E PHY and controller chiplet-enabled platform ...