Foveros技术则分为Foveros 2.5D、Foveros 3D等多种形式，强调在连接芯片与晶圆时采用焊料这一关键技术，以此实现高速I/O与较小芯片模块的理想兼容。这些封装技术都在不断地迭代，并被广泛应用于AI和HPC产品中，充分展现出Intel的技术实力。

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

[SAN FRANCISCO] Incoming Intel chief executive officer Tan Lip-Bu, who was named to the position this week, will receive compensation valued at about US$69 million if he reaches targets over the ...

which will integrate 47 tiles in a package using Foveros and Intel’s Embedded Multi-die Interconnect Bridge technology to deliver a petaflop of compute power for high-performance computing ...

The Synopsys High-Bandwidth Interconnect PHY IP enables high bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and networking applications. ...

You’ve probably tracked a package from FedEx or the U.S. Postal Service, monitoring its progress as it nears your door. Intel is launching a similar program for its processors, letting you know ...

Incoming Intel Corp. Chief Executive Officer Lip-Bu ... about $69 million if he reaches targets over the coming years. The package includes a salary of $1 million, plus a 200% performance-based ...

Intel chips have been at the core of many of ... and allows them to pass signals. Package: After wafer production is complete, each individual tile is put into a package. These are the familiar ...