Electronics Weekly14 天
JEDEC, OCP design kits progress automated SiP design using chiplets
JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test. Basically, they are a way for chiplet builders ...
EE Herald25 天
OCP and JEDEC jointly made available new Chiplet Design Kits for use with today's EDA tools
Open Compute Project Foundation (OCP) and JEDEC Solid State Technology Association announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, ...