As such, it delivers both 0.5μm/0.5μm and 2μm/2μm flexibility in L/S design, while achieving a significant increase in packaging density and bandwidth. High performance chip-package-system co-design ...

I think it's a very marketable product. Engineer Marie Adeyemi helps a team of children to research and design some packaging for raspberries using 2D and 3D design software. They discuss the ...