Displacing GaAs PAs is a long-term goal for Finwave, which has made progress on many fronts since Lesaicherre took charge in ...

Diraq said it has designed sample chips that will be manufactured this year by GlobalFoundries using its 22nm 22FDX Silicon-on-Insulator process technology, possibly as early as this month.

EAST FISHKILL, N.Y., Sept. 18, 2009-- IBM has successfully developed a prototype of the semiconductor industry's smallest, densest and fastest on-chip dynamic memory device in next-generation, ...

The work by researchers in the Center for Advanced Semiconductor Technologies could lead to energy-efficient microelectronics ...

2025年1月28日，京东方科技集团股份有限公司（BOE）宣布其最新专利申请，涉及一种名为“硅基半导体复合基板及其制备方法与应用”的技术。这项专利旨在解决当前硅基材SOI（Silicon on Insulator）和SiOG（Silicon on Glass）在大尺寸化过程中面临的技术难题。此次创新不仅有望推动半导体材料的发展，也将引领智能设备行业迎来新的变革。

Researchers at Osaka University in Suita, Japan, have devised a novel way to improve the performance of electronic devices. The study, published in ACS Applied Electronic ...