Which carrier wafer is best for the application, silicon or glass? And which debonding process among several ... Wafer thinning, temporary bonding, thin wafer processing, and debonding methods are ...

An image of the 4.7-μm 4-inch wafer with arrow ... three more manufacturing steps than conventional PV mass production processing. It first deposits a 70 nm silicon nitride (SiNx) layer on ...

The company sees the pilot as a step towards using a more sustainable method to produce solar grade silicon for the ... integrating it into post-processing steps,” said Podgorski.