2 Solder balling occurs if the solder paste spatters (small explosive) or the solder paste slump and the flux spreads. 1- 1.5°C/second ramping rate is recommended to minimize those defects.

Researchers from the University of New South Wales (UNSW) and Chinese-Canadian PV module maker Canadian Solar have investigated the effect of soldering flux on both TOPCon and heterojunction (HJT ...

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Arizona Expo & Tech Forum taking ...

Oxidation can negatively impact the conductivity and cause the solder joint to fail. To avoid this, use a rosin flux on the ...