Image source: Pavlidis & Friedman, Three-dimensional Integrated Circuit Design (2010) In the late 1960s and early 1970s, chips became increasingly complex. The forefront of semiconductor ...

Such unique features have been derived from the three-dimensional vertical columnar structure of the channel surrounded ... This is an innovative challenge for a new era of the integrated circuits ...

In Germany, in 1949, Werner Jacobi of Siemens AG filed a patent for something very much like an IC, consisting of five transistors on a common substrate as a three-stage amplifier for a small ...

A microchip with nearly 6,000 transistors, each only three atoms thick, is the most complex microprocessor made from a two-dimensional material to date, scientists in China say. The new device was ...