SAN JOSE, Calif. and HSINCHU, Taiwan, April 7, 2015 -- Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under ...

And we heartily endorse that. The chip is an ATtiny20 in a WLCSP (wafer-level chip-scale package) that’s a mere 1.5 mm by 1.4 mm. The underside of the chip has twelve tiny solder balls in a ...

MSA330 is the world's 1 st MEMS accelerometer enabled by WLCSP (Wafer Level Chip Scale Packaging), which is based on WLP and TSV technology. This approach belongs to the latest generation for MEMS ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

WLCSP stands for Wafer Level Chip Scale Packaging; the A30 is also available in other packages such as HVQFN20. The NXP EdgeLock A30 Secure Authenticator communicates via I2C bus. It contains a ...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Under the alliance, RRP Electronics – a firm focused on assembling and testing of semiconductor components – will utilise Deca’s cutting-edge wafer-level ... Deca’s WLCSP and M-Series ...