And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

SAN JOSE, Calif. and HSINCHU, Taiwan, April 7, 2015 -- Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under ...

Silicon Labs unveils the ultra-low-power BG29 Bluetooth wireless SoCs with expanded memory at Embedded World 2025.

The BG29 is available in compact quad flat no-lead (QFN) and wafer-level chip scale packages (WLCSP), featuring substantial ...