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Semiconductor Engineering
15 小时
Chip Architectures Becoming Much More Complex With Chiplets
Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...
Semiconductor Engineering
4 天
Chiplets Still A Challenge With UCIe 2.0
New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are ...
Semiconductor Engineering
4 天
Advanced Packaging Moving At Breakneck Pace
A chiplet supermarket is still years off, but progress is being made on all fronts.
Semiconductor Engineering
3 天
AI Infrastructure At A Crossroads
DeepSeek leverages algorithms such as Mixture of Experts (MoE), which demand a lot of memory bandwidth and produce large ...
Semiconductor Engineering
7 天
Assembly Design Rules Slowly Emerge
Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...
Semiconductor Engineering
10 天
Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...
Semiconductor Engineering
5 天
Electrifying Everything: Power Moves Toward ICs
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Semiconductor Engineering
6 天
Research Bits: Jan. 28
Researchers from Nokia Bell Labs developed a new type of optical memory called a programmable photonic latch that enables ...
Semiconductor Engineering
4 天
Topology And Connection Architecture Of CXL Pooling Systems (Microsoft, Columbia)
Scalable Low-Cost CXL Memory Pooling” was published by researchers at University of Washington, Microsoft Azure and Columbia ...
Semiconductor Engineering
7 天
The Road To Super Chips
Challenges in achieving orders of magnitude performance improvements in processors.
Semiconductor Engineering
6 天
What IoMT Really Stands For
The growing internet of medical things (IoMT) has unique definitions and testing requirements.
Semiconductor Engineering
5 天
Blog Review: Jan. 29
SEMI’s Ana Bernardo reports on key discussions at the recent MEMS & Imaging Sensors Summit 2024, including implications for ...
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