The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

TSMC will have new 2nm production up and running later this year, while A14 (1.4nm) wafer production is expected in 2028, 1nm ...

The A14, which won't enter production until 2028, builds on TSMC's upcoming N2 process (scheduled for later this year). Ac ...

TSM showcases A14 chip at tech symposium, plans 1.4-nm chip production in 2028. A14 offers faster computing and greater power ...

SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Semiconductor chips have traditionally been manufactured in two dimensions. But as devices become more powerful and compact, ...

Taiwan Semiconductor Manufacturing (TSM) revealed its latest logic process technology, A14, which it expects to improve in ...

Finally 3D integration introduces small form factor which is very suitable for mobile devices. The importance effect of stacking in 3D structure is increased peak temperature [14] [15] [16]. The ...