We have spent decades as a trusted manufacturer for global companies, but it is now time to be the innovators and the ...

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Altera Corporation unveiled its latest programmable solutions tailored for embedded developers who are pushing the boundaries ...

Market is set to reach an impressive USD 114 billion by 2034, up from USD 48.1 billion in 2024. This growth is projected at a robust CAGR of 9.00% between 2025 and 2034. In 2024, the Asia-Pacific ...

Morse Micro, the provider of Wi-Fi HaLow chips, has launched the MM8102, a new Wi-Fi HaLow SoC tailored for mass IoT ...

Altera highlights its latest FPGA innovations at Embedded World 2025, including the Agilex 3 and Agilex 5 E-Series FPGAs.

ALTERA Agilex FPGAs, Quartus Prime Pro software and FPGA AI Suite enable the rapid development of highly customized embedded ...

Altera’s Agilex 3 FPGA, built for power-constrained applications, almost doubles the performance of the Cyclone V.

Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...