Nexperia has announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection ...

Nexperia has unveiled a new portfolio of high signal integrity, bidirectional automotive ESD protection dIodes.

Nexperia has announced a new portfolio of high signal integrity, bidirectional ESD protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is ...

Nexperia announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in ...

We recently published a list of Buy The Dip On These 10 Semiconductor Stocks Tumbling On China H20 Chip Sale Ban. In this ...

E&R ensures top-tier quality through MIT manufacturing, integrating key components from leading European and US suppliers for ...

Nexperia has introduced a new range of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes housed in advanced flip-chip land-grid-array (FC-LGA) packaging. This ...

is an outsourced semiconductor packaging and test services provider. The company provides flip-chip scale package products, flip-chip stacked chip scale packages, memory products, flip-chip ball ...

Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering ...