Vessel-on-a-Chip (VoC) platforms provide physiologically relevant models to study vascular biology and disease mechanisms in vitro. This thesis focuses on optimizing the fabrication of a complex ...

Abstract: On-chip bandpass filter (BPF) designs with high out-of-band rejection are proposed by virtue of 3D glass-based advanced packaging technology. The proposed BPF design employs multiple ...

We first used this PDAC-on-chip model as a proof-of-principle to deliver small molecule drug candidates via a vasculature to the 3D spheroids. As one example, we identified vorinostat, a histone ...

China’s leading memory chip manufacturer, ChangXin Memory Technologies (CXMT), has issued a rare recruitment announcement for its Japanese branch, shedding light on the subsidiary as the company ...

Batam-based private shipyard PT Karimun Anugrah Sejati (KAS) has delivered the second Bung Karno-class vessel on order for the Indonesian Navy. Named KRI Bung Hatta and applied with pennant number ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology ...

Researchers at UMass Amherst developed a novel method for aligning 3D semiconductor chips using laser light and concentric metalenses, projecting holograms that reveal even atomic-scale misalignments.

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

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Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...