Moving data through a chip or package, and between packages and systems, is becoming a much bigger challenge as the volume of data continues to explode, and as more compute resources are deployed to ...
Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia Tech. Abstract: “3D heterogeneous ...
A new technical paper titled “Exploring the Potential of Wireless-enabled Multi-Chip AI Accelerators” was published by researchers at Universitat Politecnica de Catalunya. Abstract “The insatiable ...