CEA-Leti scientists presented three papers at Photonics West 2025 detailing the institute's latest R&D successes to improve chemical detection, high-speed communication ... Semiconductor Packaging ...

Reophotonics Ltd, a member of the ioTech group, is proud to announce it has received the highly prestigious EIC Accelerator Award from the European Innovation Council (EIC) ... Semiconductor Packaging ...

Enhanced scalability, allowing companies to remain agile and responsive in an ever-changing demand landscape As the first ...

Samsung, SK hynix concerned over US commerce secretary nominee's plan to review chip subsidies: Summary Howard Lutnick, Trump’s commerce secretary nominee, cast doubt on U.S. su ...

The global semiconductor industry faces setbacks as major fabs halt operations. GlobalFoundries-STMicro's €7.5B France fab and Sumitomo Electric's SiC wafer plant are suspended, while Wolfspeed and ...

Summary UCIe 2.0 advances chiplet technology with higher bandwidth and improved power efficiency, but true plug-and-play interoperability remains elusive. While data centers embrace the standard, ...

Intel issues weak forecast, but beats on fourth-quarter results: Summary Intel topped Q4 earnings and revenue estimates but issued weak guidance, sending shares up 3% after hours.

IBM rallies 13%, notches best day since 2000 on strong earnings: Summary IBM shares soared 13% Thursday after a strong Q4 report highlighted AI-driven software growth. Revenue hit ...

DeepSeek’s AI claims have shaken the world — but not everyone’s convinced: Summary DeepSeek’s AI breakthrough rattled markets, claiming its model rivals OpenAI’s at a fr ...

Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics ...

Summary The shift to chiplets is surging, with 50% of high-performance computing now multi-die. AI demands 100% chiplet-based designs, fueling new standards and interconnects. Companies race to ...