This topology is applied to data lines D[63:0] and data strobes DQS[7:0]. These signals are routed with two vias, one near VX700 for BGA escaping, and the other near the memory BGA pads. The traces to ...

Hun-sik Kang, In-ki Hwang, Chan-won Park, Gi-jong Koo, Jae-ho Lee, Jung-hak Kim, Woon-seob So, ...

With self-developed chips Apple will reduce its dependence on third-party suppliers, thereby reducing component costs and optimizing the supply chain. This not only helps to improve the ...

答：扇出是指从 BGA 等封装的焊球引出走线的过程。 扇出设计原则是尽量缩短走线长度，减少过孔数量。 保证扇出的走线均匀分布，避免出现局部密集或稀疏的情况。 要满足信号完整性和电气性能的要求。 三十、高速差分线对蛇形走线 1、在 PCB Layout 中 ...