Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

highly configurable HBM controller that can be fine-tuned to maximize the efficiency for application-specific AI and high-performance computing workloads. UCIe: Advancing toward a universal chiplet ...

The platform allows for SiPs with up to 6000mm² of 3D-stacked silicon with 12 HBM modules ... of compute chiplets and stacking one logic chiplet on top of another in a face-to-face (F2F) manner ...

Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

The company has a new memory architecture called high-bandwidth flash that fuses the massive storage capacity of 3D NAND with the kind of bandwidth offered by HBM. This hybrid creation stacks up a ...