Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

“Wafer-level test plays a critical and intricate role in the chiplet manufacturing process. Take the case of HBM. It enables early identification of defective DRAM and logic dies so that they can be ...

The platform allows for SiPs with up to 6000mm² of 3D-stacked silicon with 12 HBM modules ... of compute chiplets and stacking one logic chiplet on top of another in a face-to-face (F2F) manner ...

Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

The company has a new memory architecture called high-bandwidth flash that fuses the massive storage capacity of 3D NAND with the kind of bandwidth offered by HBM. This hybrid creation stacks up a ...