Chicago University, USA, will confer an Honorary Doctorate in Electroplating at its Noida, Uttar Pradesh campus on February 1 ...

Show Full Article The recipient, Bikramjit Bambi, a prominent industrialist with decades of experience, has played a key role in advancing nickel, silver, and gold plating technologies, contributing ...

Fig. 3: Chemical dipping deflashing process mechanism. The main purpose of the deflashing process is to remove mold flash on copper surfaces to ensure plating can be done effectively [5]. This study ...