Stanford University researchers have unveiled a material—niobium phosphide—that could revolutionize chip design by dramatically reducing energy loss in ultra-thin interconnects.
Featuring a 1.27mm pitch and a variety of pin-count options, the latest additions provide improved assembly, secure mating, and high reliability under challenging conditions.
A new series of multi-turn, surface-mount cermet trimmers offers a space-saving design, wide operating temperature range, and IP67 sealing, making them ideal for industrial, consumer, and telecom ...