Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for a multitude of packaging ...

Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The Electronic Components & Technology Conference ...

Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering ...

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The Electronic Components & Technology Conference ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The Electronic Components & Technology Conference ...

Intel and TSMC showcased their latest SRAM advancements at ISSCC, leveraging nanosheet transistors for greater density—boosting Intel's by 23% and TSMC's by 12%. Meanwhile, Synopsys achieved similar ...

Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light on the evolving convergence between ASP and SMT.