The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]

Land grid array(LGA) are molded array packages based on laminate interposer, which have an external pin or I/O on the bottom of the package arranged in columns and rows as shown in Figure 1.

This application note provides guidelines for the handling and assembly of NXP land grid array (LGA), sometimes referred to as laminated quad flat no lead (QFN), packages during printed‐circuit board (PCB) assembly. Rewrite. Combined AN3311, AN3484, AN2920, and AN3241 with this version.

Land Grid Array (LGA) is a package in which the lands are arranged in a grid pattern on the bottom of the package. Land Grid Array (LGA) is suitable for high-speed and high-frequency operation because of its small terminal parasitic inductance.

The Land Grid Array, or LGA, is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array) or solder balls (as in the ball grid array). These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body, hence the name 'land grid array'.

LGAs are grid array packages with terminal pads on the bottom surface. These are leadless packages with electrical connections made via lands on the bottom side of the component to the surface of the connecting substrate (PCB, ceramic, LTCC, etc.).

LGA (Land Grid Array) positively influences system stability during resource-intensive tasks. The direct connection between the central processing unit (CPU) and motherboard enhances electrical conductivity and reduces the risk of connection issues.

2024年6月27日 · Land Grid Array (LGA) is a surface-mount packaging technology used for integrated circuits (ICs) that offers a reliable and flexible solution for various electronic applications.

2023年8月18日 · The Land Grid Array (LGA) package is a form of technology comprising lands and an array of grid connections positioned on the inner side of the package. These grid connections serve the purpose of establishing connections on …

2022年10月18日 · Stands for "Land Grid Array." LGA is a type of processor package that places the connection pins in the socket on the motherboard rather than on the integrated circuit itself. The pins in the socket connect to flat contacts, or "lands," found …